Samtec, Inc.
MEC8-110-01-L-DV
CONN EDGE DUAL FMALE 20POS 0.031
Samtec, Inc.
MEC8-110-01-LM-DV
CONN EDGE DUAL FMALE 20POS 0.031
Samtec, Inc.
MEC1-110-02-F-D-A-TR
CONN EDGE DUAL FMALE 20POS 0.039
Samtec, Inc.
HSEC8-160-01-S-D-EM2
CONN EDGE DUAL FMALE 120P 0.031
Samtec, Inc.
HSEC8-120-01-L-RA
CONN EDGE DUAL FMALE 40POS 0.031
Samtec, Inc.
MEC6-150-02-S-D-RA1
CONN EDGE DUAL FMALE 100P 0.025
Samtec, Inc.
MEC1-160-02-S-D-A
CONN EDGE DUAL FMALE 120P 0.039
Samtec, Inc.
MEC6-140-02-S-D-RA1
CONN EDGE DUAL FMALE 80POS 0.025
Samtec, Inc.
HSEC8-180-01-L-DV-A-K
CONN EDGE DUAL FMALE 160P 0.031
Samtec, Inc.
MEC1-130-02-S-D-A-K-TR
CONN EDGE DUAL FMALE 60POS 0.039
Samtec, Inc.
HSEC8-140-01-L-RA-TR
CONN EDGE DUAL FMALE 80POS 0.031
Samtec, Inc.
HSEC8-170-01-S-DV-A-K-TR
CONN EDGE DUAL FMALE 140P 0.031
Samtec, Inc.
MEC5-050-01-L-DV-W1-K-TR
CONN MINI EDGE CARD 100POS SMD
Samtec, Inc.
HSEC8-160-01-L-DV-A-K-TR
CONN EDGE DUAL FMALE 120P 0.031
Samtec, Inc.
HSEC8-110-01-S-DV-A-K-TR
CONN EDGE DUAL FMALE 20POS 0.031
Samtec, Inc.
HSEC8-180-01-S-DV-A-K
CONN EDGE DUAL FMALE 160P 0.031
Samtec, Inc.
MEC5-080-01-L-RA-W2-TR
CONN MINI EDGE CARD 160POS R/A
Samtec, Inc.
MEC5-070-01-L-DV-W1-K-TR
CONN MINI EDGE CARD 140POS SMD
Samtec, Inc.
MEC1-120-02-F-D-RA1-SL
CONN EDGE DUAL FMALE 40POS 0.039
Samtec, Inc.
MEC1-108-02-F-D-A
CONN EDGE DUAL FMALE 16POS 0.039
Samtec Inc. is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed).To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between