t-Global Technology
FAM1-200-200-0.2-1A
RF EMI ABSORB SHEET 7.874X7.874"
t-Global Technology
FAM1-200-200-1.0-1A
RF EMI ABSORB SHEET 7.874X7.874"
t-Global Technology
FAM1-400-400-0.2-1A
RF ABSORB SHEET 15.748"X15.748"
t-Global Technology
FAM1-200-200-1.5-1A
RF EMI ABSORB SHEET 7.874X7.874"
t-Global Technology
FAM3-400-400-0.25-1A
RF ABSORB SHEET 15.748"X15.748"
t-Global Technology
FAM5-297-210-0.05-1A
RF ABSORB SHEET 11.693"X8.268"
t-Global Technology
FAM5-297-210-0.1-1A
RF ABSORB SHEET 11.693"X8.268"
t-Global Technology
FAM3-400-400-0.5-1A
RF ABSORB SHEET 15.748"X15.748"
t-Global Technology
FAM5-297-210-0.3-1A
RF ABSORB SHEET 11.693"X8.268"
t-Global Technology
FAM3-400-400-0.75-1A
RF ABSORB SHEET 15.748"X15.748"
t-Global Technology
FAM1-400-400-1.5-1A
RF ABSORB SHEET 15.748"X15.748"
t-Global Technology
FAM1-400-400-2.0-1A
RF ABSORB SHEET 15.748"X15.748"
t-Global Technology
FAM5-297-210-0.5-1A
RF ABSORB SHEET 11.693"X8.268"
t-Global Technology
FAM1-400-400-2.5-1A
RF ABSORB SHEET 15.748"X15.748"
t-Global Technology
FAM1-400-400-1.0-1A
RF ABSORB SHEET 15.748"X15.748"
t-Global Technology
FAM1-400-400-0.5-1A
RF ABSORB SHEET 15.748"X15.748"
t-Global Technology
TG-CR205-330X330X0.05
RF EMI DBL SIDED TAPE 13"X13"
t-Global Technology
TG-39ULB-330X250X0.06
RF EMI DBL SID TAPE 11.811X9.843
t-Global Technology
FAM1-200-200-2.5-1A
RF EMI ABSORB SHEET 7.874X7.874"
t-Global Technology
LP0001/01-L37-3F-0.25-2A
STAR THERMAL PAD LED STAR BRD
t-Global Technology is a leading manufacturer and supplier of thermal management solutions. t-Global manufactures materials in their state of art facilities in Taiwan and the UK. Their broad product portfolio covers silicone and non-silicone gap fillers, silicone and non-silicone putties, ceramic heat spreaders, combined thermal and EMI absorbers and a wide selection of die-cut insulators. Taiwan is the central location for new product development and research and the UK takes responsibility for complex engineering projects, rapid prototyping and dispensing technology. t-Global’s philosophy is based around a very short lead-time and low MOQ’s, which translates into rapid prototyping and a short time to market.